Thermal Silicone Grease Compound Glue Heatsink Plaster STARS-922 Elecrow bazaar, Make your making 3D Printer? project easy.

Details

Stars-922 Heatsink Plaster which is high conductivity, low bleed, stable at high temperatures, viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels. Primary Use: Thermal coupling of nozzle for 3D printer or CPU.

Features

Dissipation coefficient: <0.005
Temperature resistance: 200 degree Celsius
Silicone thermal compound
Thermal Conductivity: >1.22W/m.k

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