Protoboard THT SOIC 50x80mm

Description:

Protoboard for SOIC and Through-hole components.

More and more components are only available in SMD these days. That makes it difficult to build a prototype on a standard 0.1" protoboard.  On this board you can combine standard THT components with SMD components in SOIC packages, using a pitch of 0.05". That brings a large number of modern opamps within range, as wel as a number of microprocessors and support chips.

The board includes pads only. There are no connections between any pads. As with standard 100mil protoboards, the user is invited to add wiring by soldering thin wires between pads.

We have chosen SOIC since this makes many modern opamps possible, and it is still large enough to allow manual soldering.

Some examples:

• Dual Opamps such as OPA2991IDR, OPA2196IDR, TLV272QDR. etc
• Quad Opamps such as OPA4991IDR, OPA4196IDR, TLV274QDR, etc
• Narrow SOIC processors AVR : AtTiny1624, AtTiny3224 etc
• Wide SOIC processors AVR : AtTiny806, AtTiny1606 etc
• Wide SOIC processors PIC : PIC16F88x/SO etc
• Double H-Bridge L6205

An example project is this audio amplifier using an OPA4991. (Please note that some THT holes had to be re-drilled for the thicker pins on the connectors).

Features:

• Board size 50 x 80 mm.
• Combines SMD 1.27mm (50mil) with THT components.
• Suitable for narrow  and wide SOIC components.
  • SOIC (3.8mm body width) JEDEC MS-12.
  • SOIC-W (7.5mm body width) JEDEC MS-13.
  • SOP (5.3mm body width).
  • SO-8, SO-14
• Fully metalised pads.
• SOIC pads accessible from top as well as bottom side of the pcb, inter-connected by vias.
• 2 power rails between the SMD pads, interconnected top to bottom.
• 2 rows of 63 SOIC pads.
• 2 THT area's of 32 x 7 holes, pitch 100 mil (2.54 mm).
• THT drill size 0.8 mm.
• Soldermask on both sides.
• Silkscreen lining for easy reference of pins and pads on top and bottom.