Hexapod Crown QFP to SOIC Adapters (5-pack)

Sold in packs of 5 boards.

Hexapod Crown QFP Adapters adapt QFP32 and QFN16 packages to the standard 50mil SOIC/SOP format. These adapters are intended to be soldered to a larger host board, such as the Hexapod Carnival W or Hexapod Ritual W protoboards. Note that the W (wide) versions of these host boards must be used for the crown to fit.

The crown also provides distribution pads connected to each of the pin landings on the QFP footprint. These distribution pads can host decoupling capacitors and pull-up/pull-down resistors on the crown board itself, rather than using space on the host board.

On the upper and lower perimeters of the board, the central castellated notches are connected to the ground plane on the back side of the board. The ground plane is in turn connected to the ground pad in the center of the QFP footprint, and to the vertical ground pads on the far left and right of the crown. An extra notch on each of the corners is provided to make it easy to route power and ground to the distribution pads.

When the crown is to be soldered directly to a host board we recommend adding a piece of Kapton tape between the crown and the host, to serve as an extra electrical insulation layer. The solder mask on the back of the board can vary in thickness due to manufacturing tolerances and can be thin in the region around the vias. 

Hexapod Crowns come with two different pad pitches for the QFP package.

• Hexapod Crown KQA has 0.8mm pad pitch
• Hexapod Crown KQC has 0.5mm pad pitch

Design templates are available that describe the pad connections and can be used to plan your circuits.

• Hexapod Crown KQA 0.8mm design template (PDF)
• Hexapod Crown KQC 0.5mm design template (PDF)

Ground Connections

Hexapod Crown QFP adapters have a central ground pad which is connected to the ground plane on the back of the board. The central casselated notches on the top and bottom perimeter are also connected to the ground plane, along with the vertical pads on the far left and right:

Distribution Pads

Each landing pad of the QFP footprint is connected to an associated distribution pad, as well as to its corresponding casselated notch on the perimeter of the board. The following image shows a subset of these connectons. See the above the design templates for the full mapping. The order of connections in both Hexapod KQA and KQC adapters is identical.