Hexapod Web Six Layer Through-Hole Protoboard

Hexapod Web protoboards provide the common 100x100mil through-hole grid combined with power and ground distribution, as well as vertical and horizontal cross connections. Every through-hole has access to the ground and power planes via directly adjacent pads.

Web protoboards have size 30 x 70 x 1.6mm. All boards have ENIG (gold flashed) surface finish and use a matte-green solder mask to reduce glare under bright lighting.

A design template is available to plan your circuit:

• web A design template (PDF)

Power and Ground connections

Every through-hole has an adjacent power and ground pad, which are circle and start shaped respectively. These pads connect through to the corresponding power and ground planes which are located on their own layers in the board, and fill the majority of space between the through-holes The mounting holes are also connected to the ground plane.

Cross Connections

Cross connections are accessed via the diamond shaped pads. The vertical and horizontal cross connections are located on their own respective layers and are routed between the through-holes. Cross connections make it easy to distribute signals from the edge of the board into the middle, reducing the need for long jumper wires when building prototypes.

Layer Order (Stackup)

Hexapod Web boards are fabricated with six copper layers in the following order:

1. front side pads
2. ground plane
3. power plane
4. horizontal cross connections
5. vertical cross connections
6. back side pads

Although the layout of the front and back side pads is identical, we recommend attaching the majority of the components and wiring needed for a prototype to the front side of the board, which is closest to the ground plane. The front side can be identified by holding the board under bright light and looking for the edge of the ground plane, which can be seen through the translucent green solder mask. In the following diagram, the image on the left shows the front side of the board, where the edge of the ground plane is visible in the red circle. The image on the right shows the back side of the board, where the color of the solder mask inside the red circle is more uniform.