Hexapod Bones Hybrid Surface Mount Protoboard

Hexapod Bones protoboards are designed for hybrid through-hole / surface mount prototyping.

Bones protoboards provide the common 100x100 mil through-hole grid interleaved with a second offset 50 mil grid. The two grids combined support common 100 mil pitch through-hole components such as switches and potentiometers, along with 50 mil pitch surface mount components. The smaller plated vias on the offset 50 mil grid are connected vertically across the board in bread-board style, for easy connection to SOIC/SOP format devices.

Bones protoboards come in two sizes:

• bones KA (bAse) is 30 x 70 x 1.6mm
• bones KW (Wide) is 40 x 70 x 1.6mm

All boards have ENIG (gold flashed) surface finish and use a matte-green solder mask to reduce glare when working under bright lighting.

Design templates are available to plain your circuit

• bones KA design template (PDF)
• bones KW design template (PDF)