Hexapod Festival Surface Mount Protoboard

PCB only. The other components shown in examples are not included.

Hexapod Festival protoboards are designed for direct surface mount prototyping. The pads have a horizontal pitch of 50-mil (1.27mm), which works well for components using SOIC, SOT-23, TO-252, 0603 and 1206 footprints. 

Festival boards use an enhanced form of the Hexapod Ritual design. Four separate signal lines run along the top and bottom of the board, for eight lines in total. Signal lines are selected by soldering a short (2mm) piece of uninsulated wire from the signal pad to an adjacent distribution pad. This rich cross-board connectivity allows circuits to be built up in connected modules while avoiding jumper wires crossing left and right over the board.

The signal pads take the form of sigils with the following names:

The face is the distribution pad. Clockwise from the top we then have hat, lamp, cone, cup and shade. All the hats are ground. All the lamps along the top edge of the board are connected together, so are all the cones, cups and shades thus connected. The sigils along the bottom edge of the board form their own independent set.

Festival protoboards come in two sizes:

• festival A (bAse) is 30 x 70 x 1.6mm
• festival W (Wide) is 40 x 70 x 1.6mm

All boards have ENIG (gold flashed) surface finish and use a matte-green solder mask to reduce glare when working under bright lighting.

Design design templates are available to plan your circuit:

• festival A design template (PDF)
• festival W design template (PDF)